VR Industry Leaders Team to Launch World’s First VR Bundle for Innovation and Research

VR First, Intel, HTC Vive, Leap Motion, CDWG, Futuremark, MixCast, SpringboardVR and Senses Global Lead the Charge

VR First’s Global VR/AR Democratization Effort Grows with Support from IEEE, E&I, IASP, IGDA, SMARTlab-IDRC, VRARA and WBAF; Expands to Latin America, Africa and APAC.

VR First, the global initiative for enabling VR/AR innovation, along with a team of VR/AR industry leaders, announced the launch of the world’s first VR Academic Purpose bundle, consisting of hardware, services and support/mentorship by key industry organizations, designed for academic research, development and innovation purposes. Announced at the VRX Conference & Expo in San Francisco today, the bundle will allow academic institutions and science parks to engage with immersive technologies and grow their VR/AR labs.

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VR First’s Academic Purpose VR Bundle
VR First’s Academic Purpose VR Bundle is being made available in partnership with Intel, HTC Vive, Leap Motion, CDWG, Futuremark, MixCast, SpringboardVR and Senses Global. Created to lower entry barriers for students, developers, entrepreneurs and researchers to access the latest VR/AR technologies, the bundle includes:

  • HTC Vive’s VR headset with accessories such as the Vive Deluxe Audio Strap and Vive Tracker, as well as education-related content through the Viveport store;
  • Intel® Core™ i7: VR Ready PCs powered by Intel® Core™ i7 processors to deliver the best experience and performance for VR content creation and development;
  • Leap Motion hand tracking technology directly attached to VR/AR headsets;
  • VRMark Professional Edition benchmarking software for VR performance from Futuremark;
  • MixCast by Blueprint Reality, which enables blending of real people with virtual worlds to create compelling 2D content from VR applications in real-time;
  • SpringboardVR‘s VR management software for automating storage, distribution and launch of VR Content;
  • The Academic Bundle catalogue of procurement and logistics services by international technology solutions provider CDWG;
  • Access to technology solutions & services in VR, AR, Human Augmentation and Smart Robots by Senses Global;
  • Guidance based on standards and recommended practices developed by the IEEE VR/AR Working Group;
  • Access to VR First’s extensive network of industry partners for expertise insight on building powerful communities equipped with cutting edge technology and knowledge.

The Academic VR Bundle is now available through VR First as part of its Regional Growth Services program. VR First is inviting all academic institutions, science parks and innovation centers to join and learn about special bundle rates and opportunities available through VR First’s industry network.

“Starting early 2018, we will add further hardware devices and software solutions to the academic bundle. By that, VR First also expands the addressable market for partners through global academic and developer reach,” said Ferhan Özkan, CEO of VR First

“Education and academia are pushing the forefront of what’s possible in VR today,” said Daniel O’Brien, GM US, Vive. “VR First has created a bundle of hardware and software that serves academic needs, educational requirements and increases the accessibility HTC Vive globally. We’re happy to support their efforts to bring VR to more educational institutions.”

“As the core innovators of technology, Intel is constantly working on new ways to incentivize VR/AR development on a global scale. It is only right that we cooperate with VR First, IEEE and other industry and network partners to strengthen early adoption and reiterate our shared commitment to the democratization of VR/AR innovation,” said Frank Soqui, General Manager for VR at Intel.

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